TOPPAN Inc. is a Japanese printing and solutions group within TOPPAN Holdings, operating globally across packaging, communications, security, and electronics. Building on high-volume printing and materials engineering, the company develops products for brand owners, governments, and technology manufacturers, spanning flexible packaging, security documents, and advanced substrates for semiconductors.

Businesses

Packaging offerings include high-barrier films and mono-material structures such as GL BARRIER/GL FILM. Security activities are delivered through TOPPAN Security, covering identity and payment technologies and secure document production. In electronics, TOPPAN manufactures semiconductor package substrates including high-density FC-BGA for AI/data-center devices.